Invention Application
- Patent Title: HEAT SINK AND MANUFACTURING METHOD THEREFOR
- Patent Title (中): 其散热及其制造方法
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Application No.: US11867899Application Date: 2007-10-05
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Publication No.: US20080084665A1Publication Date: 2008-04-10
- Inventor: Neil Tigwell
- Applicant: Neil Tigwell
- Priority: GB0619683.6 20061005
- Main IPC: H05K7/20
- IPC: H05K7/20 ; B21D53/02
Abstract:
A heat sink has a structure fabricated of aluminum, with at least a portion of this structure having a surface with at least a portion thereof exposed to a device to be cooled and/or to a coolant liquid at least this portion being hard-anodized. This portion of the structure is rendered electrically insulating and/or corrosion resistant by a hard-anodized surface layer thereon.
Information query
