A system and method of processing a substrate. The method and system applies a liquid to a surface of the substrate so as to form a film of the liquid on the surface of the substrate, wherein a boundary layer exists at the interface of the surface and the film of the liquid. The cleaning system then applies a force that penetrates the boundary layer so as to create a localized area on the surface of the substrate that is substantially free of the liquid. The application of the force in combination with the liquid removes particles from the surface of the substrate.