发明申请
- 专利标题: Thermal module
- 专利标题(中): 散热模块
-
申请号: US11652106申请日: 2007-01-11
-
公开(公告)号: US20080087404A1公开(公告)日: 2008-04-17
- 发明人: Yun-Liang Hsieh , Han-Ting Chen , Jung-Wen Chang
- 申请人: Yun-Liang Hsieh , Han-Ting Chen , Jung-Wen Chang
- 申请人地址: TW Tao Yuan Shien
- 专利权人: Quanta Computer Inc.
- 当前专利权人: Quanta Computer Inc.
- 当前专利权人地址: TW Tao Yuan Shien
- 优先权: TW95218270 20061016
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A thermal module includes an evaporator, a metal pipe, a main frame, a heat sink, a wick and a cooling liquid. The evaporator is in touch with a heat source and has a gas outlet and a liquid inlet. Two ends of the metal pipe connect separately with the gas outlet and the liquid inlet of the evaporator to from a closed loop. The metal pipe includes a vapor pipe, a condenser and a liquid pipe. The main frame connects with the wall of the metal pipe near the gas outlet. The heat sink is outside the condenser. The wick is positioned in an inner wall of the evaporator and in the gas outlet. The cooling liquid is in the closed loop.
信息查询