发明申请
- 专利标题： SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 固态成像装置及其制造方法
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申请号： US11756163申请日： 2007-05-31
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公开(公告)号： US20080087977A1公开(公告)日： 2008-04-17
- 发明人: Shinya Watanabe
- 申请人： Shinya Watanabe
- 申请人地址： JP Tokyo 108-0075
- 专利权人： SONY CORPORATION
- 当前专利权人： SONY CORPORATION
- 当前专利权人地址： JP Tokyo 108-0075
- 优先权： JP2006-160001 20060608
- 主分类号： H01L31/0224
- IPC分类号： H01L31/0224 ; H01L31/18
摘要：
The present invention provides a solid-state imaging device having an element isolation layer that is formed by embedding a conductive material into a trench-processed groove portion provided in a semiconductor base, in which a predetermined voltage is applied to the element isolation layer.
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