发明申请
US20080088595A1 Interconnected two-substrate layer touchpad capacitive sensing device
审中-公开
互连双基层触摸板电容式感应装置
- 专利标题： Interconnected two-substrate layer touchpad capacitive sensing device
- 专利标题（中）： 互连双基层触摸板电容式感应装置
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申请号： US11580607申请日： 2006-10-12
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公开(公告)号： US20080088595A1公开(公告)日： 2008-04-17
- 发明人: Hua Liu , Weng Xiao-Ping
- 申请人： Hua Liu , Weng Xiao-Ping
- 主分类号： G06F3/041
- IPC分类号： G06F3/041
摘要：
A touch-sensor device has a first board coupled to a second board. The first board has a first substrate with a first plurality of sensing elements and a second plurality of sensing elements. A first plurality of conductive trace connects the first plurality of sensing elements along a first axis. A dielectric material is formed on the first plurality of sensing elements and on the first plurality of conductive traces. The second board has a second substrate and a second plurality of conductive traces that connects the second plurality of sensing elements along a second axis.
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