发明申请
- 专利标题: Method for Manufacturing Semiconductor Device
- 专利标题(中): 半导体器件制造方法
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申请号: US11840342申请日: 2007-08-17
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公开(公告)号: US20080090334A1公开(公告)日: 2008-04-17
- 发明人: Kuan-Chun Chen
- 申请人: Kuan-Chun Chen
- 优先权: TW95137588 20061012
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A method for manufacturing a semiconductor device is described. The method comprises: providing a mold; coating a glue on a surface of the mold; providing at least one semiconductor chip, wherein the semiconductor chip includes a first side and a second side on opposite sides, and the first side of the semiconductor chip is pressed into a portion of the glue to expose the second side of the semiconductor chip; forming an adhesive layer to cover the second side of the semiconductor chip and the exposed portion of the glue; forming a metal heat sink on the adhesive layer; removing the glue and the mold; disposing a circuit board on the exposed portion of the adhesive layer; providing wires to electrically connect the circuit board to the semiconductor chip; and forming an encapsulation layer to completely encapsulate the semiconductor chip, the wires and the exposed portion of the adhesive layer.
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