发明申请
- 专利标题： Microelectronic component with foam-metal posts
- 专利标题（中）： 微电子元件与泡沫金属柱
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申请号： US11546899申请日： 2006-10-12
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公开(公告)号： US20080090427A1公开(公告)日： 2008-04-17
- 发明人: Giles Humpston , Jesse Burl Thompson
- 申请人： Giles Humpston , Jesse Burl Thompson
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01R12/00
- IPC分类号： H01R12/00
摘要：
A microelectric component having a base and a plurality of conductive posts extending from said base. Each of the posts is formed from a connected lattice of metal having voids therein. The lattice may be formed by depositing metal onto a sacrificial element such as an open-celled polymeric foam. During use or during processing, the posts may be deformed, as by crushing the lattice.
公开/授权文献
- US07510401B2 Microelectronic component with foam-metal posts 公开/授权日：2009-03-31
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