Invention Application
- Patent Title: DIGITAL CAMERA MODULE PACKAGE
- Patent Title (中): 数码相机模块包
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Application No.: US11617070Application Date: 2006-12-28
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Publication No.: US20080095529A1Publication Date: 2008-04-24
- Inventor: PO-CHIH HSU , MING-YUAN LIN
- Applicant: PO-CHIH HSU , MING-YUAN LIN
- Applicant Address: TW Chu-Nan
- Assignee: ALTUS TECHNOLOGY INC.
- Current Assignee: ALTUS TECHNOLOGY INC.
- Current Assignee Address: TW Chu-Nan
- Priority: CN200610063219.1 20061020
- Main IPC: G03B17/00
- IPC: G03B17/00

Abstract:
A digital camera module package (200) includes a base (20), an image sensor chip package (21) and a lens module (22). The image sensor chip package is mounted on the base. The lens module includes a cavity (257). The cavity fittingly receives the image sensor chip package, and presses against a circumferential wall of the image sensor chip package. The digital cameral module package may precisely align the image sensor chip package with the lens module.
Information query