Invention Application
US20080095529A1 DIGITAL CAMERA MODULE PACKAGE 审中-公开
数码相机模块包

DIGITAL CAMERA MODULE PACKAGE
Abstract:
A digital camera module package (200) includes a base (20), an image sensor chip package (21) and a lens module (22). The image sensor chip package is mounted on the base. The lens module includes a cavity (257). The cavity fittingly receives the image sensor chip package, and presses against a circumferential wall of the image sensor chip package. The digital cameral module package may precisely align the image sensor chip package with the lens module.
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