Stacked Die in Die BGA Package

Invention Application

US20080096316A1 Stacked Die in Die BGA Package 有权

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Patent Title: Stacked Die in Die BGA Package
Application No.: US11959013

Application Date: 2007-12-18
Publication No.: US20080096316A1

Publication Date: 2008-04-24
Inventor: Hock Tan , Thiam Lim , Victor Tan , Chee Neo , Michael Tan , Beng Chew , Cheng Pour
Applicant: Hock Tan , Thiam Lim , Victor Tan , Chee Neo , Michael Tan , Beng Chew , Cheng Pour
Applicant Address: US ID Boise 83706-9632
Assignee: MICRON TECHNOLOGY, INC.
Current Assignee: MICRON TECHNOLOGY, INC.
Current Assignee Address: US ID Boise 83706-9632
Priority: SG200200134-5 20020109
Main IPC: H01L21/58
IPC: H01L21/58

Abstract:

Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.

Public/Granted literature

US07575953B2 Stacked die with a recess in a die BGA package Public/Granted day:2009-08-18

Information query

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/50	...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的
H01L21/58	....半导体器件在支架上的安装