Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Patent Title (中): 半导体器件及其形成方法
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Application No.: US11623269Application Date: 2007-01-15
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Publication No.: US20080096377A1Publication Date: 2008-04-24
- Inventor: Dong-Hwa KWAK , Jae-Kwan PARK , Jae-Hwang SIM , Jin-Ho KIM , Ki-Nam KIM
- Applicant: Dong-Hwa KWAK , Jae-Kwan PARK , Jae-Hwang SIM , Jin-Ho KIM , Ki-Nam KIM
- Applicant Address: KR Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR2006-0101957 20061019
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
In one embodiment a semiconductor device includes odd contacts and respective odd lines. Spacers are formed on sidewalls of the odd lines and even openings for even lines are formed by performing an etching process. Even contacts are formed in the even openings and then even lines are formed.
Public/Granted literature
- US07842571B2 Method for forming semiconductor device Public/Granted day:2010-11-30
Information query
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