发明申请
- 专利标题: Optical Semiconductor Sealing Material
- 专利标题(中): 光学半导体封装材料
-
申请号: US11718855申请日: 2005-11-09
-
公开(公告)号: US20080097072A1公开(公告)日: 2008-04-24
- 发明人: Tomoaki Takebe , Tsuyoshi Ota , Yutaka Obata , Hiroyuki Higuchi
- 申请人: Tomoaki Takebe , Tsuyoshi Ota , Yutaka Obata , Hiroyuki Higuchi
- 申请人地址: JP Tokyo 100-8321
- 专利权人: Idemitsu Kosan Co., Ltd.
- 当前专利权人: Idemitsu Kosan Co., Ltd.
- 当前专利权人地址: JP Tokyo 100-8321
- 优先权: JP2004-325000 20041109
- 国际申请: PCT/JP05/20509 WO 20051109
- 主分类号: C08G63/00
- IPC分类号: C08G63/00
摘要:
The present invention provides an optical semiconductor sealing material comprising a radically polymerized polymer of a methacrylate ester having an alicyclic hydrocarbon group containing 7 or more carbon atoms e.g. an adamantyl group, a norbornyl group or a dicyclopentanyl group; and an optical semiconductor sealing material comprising a radically polymerized polymer of 50 to 97 mass % of the methacrylate ester and 3 to 50 mass % of acrylate ester having a hydroxyl group. The optical semiconductor sealing material of the present invention is highly transparent and stable to UV light and thus does not undergo yellowing. In addition, the material exhibits excellent compatibility between heat resistance and refractive index, does not undergo deformation or cracking during heating processes such as reflow soldering, and shows high processability. The material can be preferably used as a sealing material for light-emitting elements and light-receiving elements of optical semiconductor devices (semiconductor light-emitting devices).
信息查询