Provided are a multi-ground shielding semiconductor package including analog and digital circuit blocks and capable of preventing a coupling problem between the analog and digital circuit blocks caused by high frequency noise. A method of fabricating the multi-ground shielding semiconductor package, and a method of preventing noise in the multi-ground shielding semiconductor package are also provided. The multi-ground shielding semiconductor package includes at least one semiconductor chip; and a circuit board on which the semiconductor chip is mounted and on which a plurality of circuit blocks are formed, wherein a conductive ground shielding is formed between the circuit blocks and separately from grounds of the circuit blocks to prevent noise between the circuit blocks.