发明申请
US20080102009A1 Configuration and process for carbonyl removal 有权
羰基去除的配置和工艺

  • 专利标题: Configuration and process for carbonyl removal
  • 专利标题(中): 羰基去除的配置和工艺
  • 申请号: US10543438
    申请日: 2004-01-21
  • 公开(公告)号: US20080102009A1
    公开(公告)日: 2008-05-01
  • 发明人: Ravi Ravikumar
  • 申请人: Ravi Ravikumar
  • 优先权: USPCT/US03/02696 20030128
  • 国际申请: PCT/US04/01796 WO 20040121
  • 主分类号: B01D3/02
  • IPC分类号: B01D3/02 F01D25/00 F02C3/22 F02C7/30
Configuration and process for carbonyl removal
摘要:
A plant includes an adsorber in which a metal is plated onto a non-metallic sacrificial materials from a metal carbonyl at a predetermined temperature. Particularly preferred adsorbers include two sections, wherein a first metal (e.g., nickel) is plated onto graphite in the first section, and wherein a second metal (e.g., iron) is plated onto graphite in the second section.
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