发明申请
US20080105457A1 Circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereof
审中-公开
具有烧结膏连接的电路化衬底和具有所述衬底作为其一部分的多层衬底组件
- 专利标题： Circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereof
- 专利标题（中）： 具有烧结膏连接的电路化衬底和具有所述衬底作为其一部分的多层衬底组件
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申请号： US12007178申请日： 2008-01-08
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公开(公告)号： US20080105457A1公开(公告)日： 2008-05-08
- 发明人: Frank Egitto , Voya Markovich , Luis Matienzo
- 申请人： Frank Egitto , Voya Markovich , Luis Matienzo
- 申请人地址： US NY Endicott 13760
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott 13760
- 主分类号： H05K1/03
- IPC分类号： H05K1/03
摘要：
A circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric is used as a layer in the substrate.
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