发明申请
- 专利标题: SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND RELATED FABRICATION METHOD
- 专利标题(中): 半导体集成电路器件及相关制造方法
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申请号: US11855529申请日: 2007-09-14
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公开(公告)号: US20080105930A1公开(公告)日: 2008-05-08
- 发明人: Jin-bum KIM , Young-pil KIM , Si-young CHOI , Byeong-chan LEE , Jong-wook LEE
- 申请人: Jin-bum KIM , Young-pil KIM , Si-young CHOI , Byeong-chan LEE , Jong-wook LEE
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 优先权: KR1020060108392 20061103
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L21/8234
摘要:
Embodiments of the invention provide a semiconductor integrated circuit device and a method for fabricating the device. The semiconductor device includes a semiconductor substrate having a cell region and a peripheral region, a cell active region formed in the cell region, and a peripheral active region formed in the peripheral region, wherein the cell active region and the peripheral active region are defined by isolation regions. The semiconductor device further includes a first gate stack formed on the cell active region, a second gate stack formed on the peripheral active region, a cell epitaxial layer formed on an exposed portion of the cell active region, and a peripheral epitaxial layer formed on an exposed portion of the peripheral active region, wherein the height of the peripheral epitaxial layer is greater than the height of the cell epitaxial layer.
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