A die micro electro-mechanical switch management system and method facilitate power conservation by selectively preventing electrical current from flowing in designated components. A present invention semiconductor die comprises a block of transistors for performing switching operations, a bus (e.g., a power bus, a signal bus, etc.) for conveying electrical current and a micro electro-mechanical switch that couples and decouples the block of transistors to and from the bus. The micro electro-mechanical switch is opened and closed depending upon operations (e.g., switching operations) being performed by the block of transistors. Electrical current is prevented from flowing to the block of transistors when the micro electro-mechanical switch is open and the block of transistors is electrically isolated. The micro electro-mechanical switch can interrupt electrical current flow in a plurality of the bus lines and/or can be included in a relay array.