发明申请
US20080107873A1 MASKING APPARATUS AND METHOD OF FABRICATING ELECTRONIC COMPONENT 有权
掩蔽设备和电子元件制作方法

  • 专利标题: MASKING APPARATUS AND METHOD OF FABRICATING ELECTRONIC COMPONENT
  • 专利标题(中): 掩蔽设备和电子元件制作方法
  • 申请号: US11925249
    申请日: 2007-10-26
  • 公开(公告)号: US20080107873A1
    公开(公告)日: 2008-05-08
  • 发明人: Hajime KUWAJIMAHitoshi Ohkubo
  • 申请人: Hajime KUWAJIMAHitoshi Ohkubo
  • 申请人地址: JP Tokyo 103-8272
  • 专利权人: TDK CORPORATION
  • 当前专利权人: TDK CORPORATION
  • 当前专利权人地址: JP Tokyo 103-8272
  • 优先权: JP2006-293245 20061027
  • 主分类号: B05C11/00
  • IPC分类号: B05C11/00 B05D5/00
MASKING APPARATUS AND METHOD OF FABRICATING ELECTRONIC COMPONENT
摘要:
A masking apparatus includes a mask base body and a mask plate. The mask base body includes at least one spacer plate, and a cavity in which an electronic component can be housed. The mask plate is disposed on an upper surface and/or a lower surface of the mask base body. The mask plate includes a film-forming opening with a shape corresponding to the shape of an external structural body to be formed on an outer surface of the component. The mask plate thus allows a film-forming operation to be selectively performed on the outer surface of the component through the film-forming opening. The cavity includes, in an inner surface thereof, a film-forming groove communicating with the film-forming opening so that the external structural body can be formed at once on an upper surface and/or a lower surface of, and also on a peripheral surface of the component.
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