发明申请
- 专利标题： Conductive Polishing Article for Electrochemical Mechanical Polishing
- 专利标题（中）： 电化学机械抛光导电抛光制品
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申请号： US11934878申请日： 2007-11-05
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公开(公告)号： US20080108288A1公开(公告)日： 2008-05-08
- 发明人: Yongqi Hu , Yan Wang , Alain Duboust , Stan Tsai , Feng Liu , Liang-Yuh Chen , Robert Ewald
- 申请人： Yongqi Hu , Yan Wang , Alain Duboust , Stan Tsai , Feng Liu , Liang-Yuh Chen , Robert Ewald
- 主分类号： B24B39/06
- IPC分类号： B24B39/06 ; H01L21/3105
摘要：
Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft material and, in one embodiment, the exposed surface may be planar.