发明申请
- 专利标题： Component-embedded board fabrication method and apparatus for high-precision and easy fabrication of component-embedded board with electronic components embedded in wiring board
- 专利标题（中）： 组件嵌入式板制造方法和装置，用于高精度和容易地制造嵌入在电路板中的电子部件的部件嵌入式板
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申请号： US12004431申请日： 2007-12-21
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公开(公告)号： US20080110021A1公开(公告)日： 2008-05-15
- 发明人: Masatoshi Akagawa , Kazunari Sekigawa , Shinichi Wakabayashi
- 申请人： Masatoshi Akagawa , Kazunari Sekigawa , Shinichi Wakabayashi
- 申请人地址： JP NAGANO
- 专利权人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人地址： JP NAGANO
- 优先权： JP2002-200055 20020709; JP2002-352440 20021204
- 主分类号： H01K3/10
- IPC分类号： H01K3/10 ; G06F19/00
摘要：
An apparatus 1 for fabricating a component-embedded board according to the present invention comprises: a detecting unit 11 for detecting, before the board 21 is covered with an insulating layer 23, the actual position of an electronic component 22 formed on the surface of the board 21; a holding unit 12 for calculating a displacement between the design position of the electronic component 22 and the actual position of the electronic component 22 on the surface of the board 21, and for holding the displacement as displacement data; and a correcting unit 13 for correcting, based on the displacement data, design data to be used for processing the board 21 after the board 21 is covered with the insulating layer 23.
公开/授权文献
- US07707713B2 Component-embedded circuit board fabrication method 公开/授权日：2010-05-04
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