发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM
- 专利标题（中）： 集成电路封装系统
-
申请号： US11558589申请日： 2006-11-10
-
公开(公告)号： US20080111215A1公开(公告)日： 2008-05-15
- 发明人: Il Kwon Shim , Antonio B. Dimaano , Henry D. Bathan , Jeffrey D. Punzalan
- 申请人： Il Kwon Shim , Antonio B. Dimaano , Henry D. Bathan , Jeffrey D. Punzalan
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/56
摘要：
An integrated circuit package system is provided including forming an external interconnect having a lead body and a lead tip, forming a lead protrusion in the lead tip, connecting a device and the external interconnect, and encapsulating the device and the external interconnect.
公开/授权文献
- US07928540B2 Integrated circuit package system 公开/授权日：2011-04-19
信息查询
IPC分类:
