发明申请
- 专利标题： Package structure having through hole in spacer thereof
- 专利标题（中）： 封装结构在其间隔件中具有通孔
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申请号： US11892693申请日： 2007-08-27
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公开(公告)号： US20080116556A1公开(公告)日： 2008-05-22
- 发明人: Che-Ya Chou , Chi-Tsung Chiu
- 申请人： Che-Ya Chou , Chi-Tsung Chiu
- 申请人地址： TW Kaohsiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaohsiung
- 优先权： TW95143251 20061122
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/02
摘要：
A package structure having through hole in spacer is provided. The package structure includes a substrate, a first chip, a spacer and a sub-package. The first chip is disposed on the substrate, to which an active surface of the first chip is electrically connected. The spacer, having a first side, a second side and a through hole, is disposed on the first chip, wherein the first side is opposite to the second side, and the through hole connects the first side and the second side. The sub-package is disposed on the spacer and electrically connected to the substrate.
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IPC分类:
