发明申请
- 专利标题： TOUCH PANEL MODULE AND METHOD OF FABRICATING THE SAME
- 专利标题（中）： 触控板模块及其制造方法
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申请号： US11937511申请日： 2007-11-09
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公开(公告)号： US20080117186A1公开(公告)日： 2008-05-22
- 发明人: Chun-Hao Wang , Ping-Wen Huang , Chiu-Mei Liu , Pheng-Chih Yu , Chin-Pei Hwang
- 申请人： Chun-Hao Wang , Ping-Wen Huang , Chiu-Mei Liu , Pheng-Chih Yu , Chin-Pei Hwang
- 申请人地址： TW Taichung
- 专利权人： WINTEK CORPORATION
- 当前专利权人： WINTEK CORPORATION
- 当前专利权人地址： TW Taichung
- 主分类号： G06F3/045
- IPC分类号： G06F3/045 ; G06F3/041
摘要：
A touch panel module including a cover and a transparent touch panel is provided. At least a portion of the transparent touch panel is directly connected to the cover. A method of fabricating the touch panel module including the following steps is also provided. First, a transparent touch panel is provided. Next, the cover is formed using injection molding technology such that at least a portion of the transparent touch panel is directly connected to the cover.
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