发明申请
- 专利标题: Substrate holding apparatus and polishing apparatus
- 专利标题(中): 基板保持装置和抛光装置
-
申请号: US11987978申请日: 2007-12-06
-
公开(公告)号: US20080119121A1公开(公告)日: 2008-05-22
- 发明人: Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
- 申请人: Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
- 优先权: JP2001-372771 20011206; JP2001-379337 20011212
- 主分类号: B24B7/04
- IPC分类号: B24B7/04 ; B24B29/02
摘要:
The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
公开/授权文献
- US07632173B2 Substrate holding apparatus and polishing apparatus 公开/授权日:2009-12-15