Invention Application
- Patent Title: PRINTED CIRCUIT BOARD
- Patent Title (中): 印刷电路板
-
Application No.: US11944813Application Date: 2007-11-26
-
Publication No.: US20080121421A1Publication Date: 2008-05-29
- Inventor: Kazuhiro Kashiwakura
- Applicant: Kazuhiro Kashiwakura
- Applicant Address: US TX Irving
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: US TX Irving
- Priority: JP2006-317214 20061124
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01R12/04 ; H05K1/11

Abstract:
Printed circuit board in which deterioration of signal transmission characteristics otherwise caused by a stub parasitically formed in a through-hole is suppressed to provide optimum high-speed signal transmission characteristics. A printed circuit board 10 includes a power supply/ground layer 11 and a signal line 12b in a dielectric layer 13, and a through-hole 12 connected to the signal line 12b. A clearance 14 which becomes an anti-pad is provided in an area between the through-hole 12 and the power supply/ground layer 11. The signal line 12b is extended from the through-hole 12 through the clearance 14 to an area below the power supply/ground layer 11. The portion of the signal line 12b arranged in the vicinity of the power supply/ground layer 11 in the clearance 14 has an area of impedance gradient 17 whose characteristic impedance becomes progressively lower in a direction away from the through-hole 12.
Public/Granted literature
- US08049118B2 Printed circuit board Public/Granted day:2011-11-01
Information query