发明申请
US20080121627A1 Methods and systems for semiconductor structure processing using multiple laser beam spots
有权
使用多个激光束点进行半导体结构处理的方法和系统
- 专利标题: Methods and systems for semiconductor structure processing using multiple laser beam spots
- 专利标题(中): 使用多个激光束点进行半导体结构处理的方法和系统
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申请号: US11980872申请日: 2007-10-30
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公开(公告)号: US20080121627A1公开(公告)日: 2008-05-29
- 发明人: Kelly J. Bruland , Stephen N. Swaringen , Brian W. Baird , Ho Wai Lo , David Martin Hemenway , Brady Nilsen
- 申请人: Kelly J. Bruland , Stephen N. Swaringen , Brian W. Baird , Ho Wai Lo , David Martin Hemenway , Brady Nilsen
- 申请人地址: US OR Portland
- 专利权人: Electro Scientific Industries, Inc.
- 当前专利权人: Electro Scientific Industries, Inc.
- 当前专利权人地址: US OR Portland
- 主分类号: B23K26/38
- IPC分类号: B23K26/38 ; B23K26/03
摘要:
Methods and systems selectively irradiate structures on or within a semiconductor substrate using multiple laser beams. The structures may be laser-severable conductive links, and the purpose of the irradiation may be to sever selected links.