发明申请
- 专利标题： Electronic component, manufacturing method of the electronic component, electronic component assembly body, and electronic device
- 专利标题（中）： 电子部件，电子部件的制造方法，电子部件组装体和电子设备
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申请号： US11892139申请日： 2007-08-20
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公开(公告)号： US20080122120A1公开(公告)日： 2008-05-29
- 发明人: Masayuki Itoh , Takao Ishikawa , Tomokazu Nakashima
- 申请人： Masayuki Itoh , Takao Ishikawa , Tomokazu Nakashima
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 优先权： JP2006-322460 20061129
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
An electronic component, includes a main body part inserted in an opening part formed in a board; and a pair of leads each of the leads having an end connected to the main body part and another end connected to a pad formed on the board; wherein the main body part is provided with the leads so that a functional surface of the main body part is positioned at a side connected to the pads of the board.