发明申请
- 专利标题： Positive resist compositions and patterning process
- 专利标题（中）： 正极抗蚀剂组成和图案化工艺
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申请号： US11987333申请日： 2007-11-29
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公开(公告)号： US20080124653A1公开(公告)日： 2008-05-29
- 发明人: Akihiro Seki , Shigeo Tanaka , Katsuya Takemura , Tsunehiro Nishi
- 申请人： Akihiro Seki , Shigeo Tanaka , Katsuya Takemura , Tsunehiro Nishi
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 优先权： JP2006-321870 20061129
- 主分类号： G03C1/73
- IPC分类号： G03C1/73 ; G03F7/26
摘要：
A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising specific recurring units. When processed by ArF lithography, the composition is improved in resolution and forms a pattern with a minimal line edge roughness.
公开/授权文献
- US07638260B2 Positive resist compositions and patterning process 公开/授权日：2009-12-29
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