发明申请
- 专利标题: Substrate processing apparatus and substrate processing method
- 专利标题(中): 基板加工装置及基板处理方法
-
申请号: US11984100申请日: 2007-11-13
-
公开(公告)号: US20080127508A1公开(公告)日: 2008-06-05
- 发明人: Hiroki Ohno , Kenji Sekiguchi
- 申请人: Hiroki Ohno , Kenji Sekiguchi
- 优先权: JP2006-314386 20061121
- 主分类号: F26B19/00
- IPC分类号: F26B19/00 ; F26B21/10 ; F26B25/08
摘要:
A substrate processing apparatus includes a chamber, and a cleaning-liquid supply unit that supplies a cleaning liquid containing hydrofluoro ether onto a substrate to be processed placed in the chamber. In the chamber, there is further disposed a gas supply unit that supplies into the chamber a gas for preventing moisture from being adhered to a substrate to be processed, when a cleaning liquid containing hydrofluoro ether is supplied onto the substrate to be processed.