发明申请
- 专利标题: HEAT DISSIPATION DEVICE WITH HEAT PIPES
- 专利标题(中): 带热管的散热装置
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申请号: US11566003申请日: 2006-12-01
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公开(公告)号: US20080128111A1公开(公告)日: 2008-06-05
- 发明人: Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
- 申请人: Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
- 申请人地址: TW Tu-Cheng
- 专利权人: Foxconn Technology Co., Ltd.
- 当前专利权人: Foxconn Technology Co., Ltd.
- 当前专利权人地址: TW Tu-Cheng
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A heat dissipation device includes a base (10), a plurality of fins (20), first and second heat pipes (30), (40), a fan holder (50) and a fan (60) secured to the fan holder. The first heat pipe includes a heat-receiving section (32) and two heat-discharging sections (34). The second heat pipe includes an evaporating portion (42) and two condensing portions (44). The condensing portions of the second heat pipe extend into the fins and are disposed adjacent to opposite ends of each of the fins. One heat-discharging section extends in the fins and is disposed between the condensing portions, thus allowing heat absorbed from the base to be evenly distributed throughout the fins by the heat-discharging sections and the condensing portions.
公开/授权文献
- US07866375B2 Heat dissipation device with heat pipes 公开/授权日:2011-01-11
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