A semiconductor chip package and printed circuit board assembly including the same which have a variable mounting orientation include a semiconductor chip disposed on a first surface of an insulating substrate, connectors symmetrically disposed at respective first and opposite second sides of the insulating substrate, a plurality of input/output connecting leads and power connecting leads electrically connected by connecting members to a plurality of internal circuits of the semiconductor chip, at least two internal circuits of the plurality of internal circuits being substantially similar circuits, and a radiating pad disposed on a second opposite surface of the insulating substrate and which is electrically connected to the semiconductor chip.