发明申请
US20080132082A1 PRECISION PRINTING ELECTROPLATING THROUGH PLATING MASK ON A SOLAR CELL SUBSTRATE
失效
精密印刷通过太阳能电池基板上的电镀掩模进行电镀
- 专利标题: PRECISION PRINTING ELECTROPLATING THROUGH PLATING MASK ON A SOLAR CELL SUBSTRATE
- 专利标题(中): 精密印刷通过太阳能电池基板上的电镀掩模进行电镀
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申请号: US11566205申请日: 2006-12-01
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公开(公告)号: US20080132082A1公开(公告)日: 2008-06-05
- 发明人: Sergey Lopatin , John O. Dukovic , David Eaglesham , Nicolay Y. Kovarsky , Robert Bachrach , John Busch , Charles Gay
- 申请人: Sergey Lopatin , John O. Dukovic , David Eaglesham , Nicolay Y. Kovarsky , Robert Bachrach , John Busch , Charles Gay
- 专利权人: APPLIED MATERIALS, INC.
- 当前专利权人: APPLIED MATERIALS, INC.
- 主分类号: H01L21/469
- IPC分类号: H01L21/469 ; B05C13/02
摘要:
Embodiments of the invention contemplate the formation of a low cost solar cell using a novel electroplating apparatus and method to form a metal contact structure having metal lines formed using an electrochemical plating process. The apparatus and methods described herein remove the need to perform the often costly processing steps of performing a mask preparation and formation steps, such as screen printing, lithographic steps and inkjet printing steps, to form a contact structure. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper. Embodiments of the invention may provide an apparatus and method of forming a solar cell device that utilizes a reusable masking device during one or more electrochemical deposition steps.