发明申请
US20080137307A1 METHOD AND SYSTEM FOR EXTRACTING HEAT FROM ELECTRICAL COMPONENTS
有权
从电气元件中提取热量的方法和系统
- 专利标题： METHOD AND SYSTEM FOR EXTRACTING HEAT FROM ELECTRICAL COMPONENTS
- 专利标题（中）： 从电气元件中提取热量的方法和系统
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申请号： US11608384申请日： 2006-12-08
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公开(公告)号： US20080137307A1公开(公告)日： 2008-06-12
- 发明人: Chris Erwin Orr , David S. Slaton
- 申请人： Chris Erwin Orr , David S. Slaton
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.