发明申请
- 专利标题: Semiconductor memory device and method for repairing the same
- 专利标题(中): 半导体存储器件及其修复方法
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申请号: US12000208申请日: 2007-12-11
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公开(公告)号: US20080137454A1公开(公告)日: 2008-06-12
- 发明人: Bong-Yong Lee , Heon-Kyu Lee , Kwang-Soo Kim , Sang-Youl Kwon
- 申请人: Bong-Yong Lee , Heon-Kyu Lee , Kwang-Soo Kim , Sang-Youl Kwon
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 优先权: KR10-2006-0125735 20061211
- 主分类号: G11C29/00
- IPC分类号: G11C29/00
摘要:
A semiconductor memory device includes a main cell array region, a first redundancy cell array region and a first dummy cell array region that are formed at one side of the main cell array region, and a second redundancy cell array region and a second dummy cell array region that are formed at the other side of the main cell array region. The first redundancy cell array region includes a first redundancy bitline, and the first dummy cell array region includes first dummy bitlines. The second redundancy cell array region includes a second redundancy bitline, and the second dummy cell array region includes second dummy bitlines. The first and second redundancy cell array regions are disposed closer to the main cell array region than the first and second dummy cell array regions.