Invention Application
US20080138643A1 Method for manufacturing copper nanoparticles and copper nanoparticles manufactured using the same
审中-公开
制造使用其的铜纳米粒子和铜纳米粒子的制造方法
- Patent Title: Method for manufacturing copper nanoparticles and copper nanoparticles manufactured using the same
- Patent Title (中): 制造使用其的铜纳米粒子和铜纳米粒子的制造方法
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Application No.: US11902238Application Date: 2007-09-20
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Publication No.: US20080138643A1Publication Date: 2008-06-12
- Inventor: Kwi-Jong Lee , Jae-Woo Joung , Young-Il Lee , Byung-Ho Jun
- Applicant: Kwi-Jong Lee , Jae-Woo Joung , Young-Il Lee , Byung-Ho Jun
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2006-0098315 20061010
- Main IPC: B22F1/02
- IPC: B22F1/02 ; B22F9/16

Abstract:
The present invention relates to a method for manufacturing copper nanoparticles and copper nanoparticles thus manufactured, in particular, to a method for manufacturing copper nanoparticles, wherein the method includes producing mixture by mixing one or more copper salt selected from a group consisting of CuCl2, Cu(NO3)2, CuSO4, (CH3COO)2Cu and Cu(acac)2 (copper acetyloacetate) with fatty acid and dissociating; and reacting the mixture by heating and copper nanoparticle.According to the present invention, copper nanoparticles can be synthesized in a uniform size and a high concentration using general copper salt as a copper precursor material in non-aqueous system without designing precursor material. The present invention is not only environment-friendly, but also economical as highly expensive equipment is not demanded.
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