发明申请
US20080139931A1 Temperature Mapping on Structural Data 审中-公开
结构数据温度映射

Temperature Mapping on Structural Data
摘要:
Temperature imaging has been recognized to improve a variety of diagnostic and interventional procedures and to predict and prevent failures of electrical circuits and equipments. A system design and method is disclosed, wherein the thermal data is fused and mapped with the data streams coming from a US, CT, or MR scanner, giving the doctors or industrial investigators the impression of being working with a known US, CT, or MR system which has been augmented by the temperature mapping capability.
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