发明申请
- 专利标题: Temperature Mapping on Structural Data
- 专利标题(中): 结构数据温度映射
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申请号: US11795457申请日: 2006-01-13
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公开(公告)号: US20080139931A1公开(公告)日: 2008-06-12
- 发明人: Torsten Butz , Jean-Philippe Thiran , Murat Kunt
- 申请人: Torsten Butz , Jean-Philippe Thiran , Murat Kunt
- 申请人地址: CH Lausanne
- 专利权人: ImaSys SA
- 当前专利权人: ImaSys SA
- 当前专利权人地址: CH Lausanne
- 优先权: EP05405026.5 20050117
- 国际申请: PCT/CH2006/000033 WO 20060113
- 主分类号: A61B5/00
- IPC分类号: A61B5/00 ; A61B8/00
摘要:
Temperature imaging has been recognized to improve a variety of diagnostic and interventional procedures and to predict and prevent failures of electrical circuits and equipments. A system design and method is disclosed, wherein the thermal data is fused and mapped with the data streams coming from a US, CT, or MR scanner, giving the doctors or industrial investigators the impression of being working with a known US, CT, or MR system which has been augmented by the temperature mapping capability.
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