发明申请
- 专利标题: SELECTIVE SURFACE ROUGHNESS FOR HIGH SPEED SIGNALING
- 专利标题(中): 选择性表面粗糙度用于高速信号
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申请号: US11610470申请日: 2006-12-13
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公开(公告)号: US20080142249A1公开(公告)日: 2008-06-19
- 发明人: Bruce J. Chamberlin , Daniel N. De Araujo , Erica E. Jasper Gant , Bhyrav M. Mutnury
- 申请人: Bruce J. Chamberlin , Daniel N. De Araujo , Erica E. Jasper Gant , Bhyrav M. Mutnury
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K3/00
摘要:
A circuit board and a method for fabricating a circuit board are provided. The circuit board includes a dielectric core comprising a first surface and a second surface and a conductive layer comprising a first surface and a second surface. The first surface of the conductive layer is coupled to the second surface of the dielectric core. A first region of the second surface of the conductive layer is smooth and a second region of the second surface of the conductive layer is rough. The first region of the second surface of the conductive layer is operable to support high speed signaling and the second region of the second surface of the conductive layer is operable to support non-high speed signaling.