发明申请
US20080145701A1 METHOD FOR MAKING ELECTRONIC DEVICES HAVING A DIELECTRIC LAYER SURFACE TREATMENT
审中-公开
用于制造具有介电层表面处理的电子器件的方法
- 专利标题: METHOD FOR MAKING ELECTRONIC DEVICES HAVING A DIELECTRIC LAYER SURFACE TREATMENT
- 专利标题(中): 用于制造具有介电层表面处理的电子器件的方法
-
申请号: US12033143申请日: 2008-02-19
-
公开(公告)号: US20080145701A1公开(公告)日: 2008-06-19
- 发明人: Timothy D. Dunbar , Tommie W. Kelley
- 申请人: Timothy D. Dunbar , Tommie W. Kelley
- 专利权人: 3M Innovative Properties Company
- 当前专利权人: 3M Innovative Properties Company
- 主分类号: B32B9/00
- IPC分类号: B32B9/00
摘要:
A method of making an electronic device by (a) depositing a substantially nonfluorinated polymeric layer onto a dielectric layer using a plasma-based deposition technique selected from the group consisting of (i) plasma polymerizing a precursor comprising monomers, and (ii) sputtering from a target comprising one or more polymers of interpolymerized units of monomers, the monomers being selected from the group consisting of aromatic monomers, substantially hydrocarbon monomers, and combinations thereof; and (b) depositing an organic semiconductor layer adjacent to said polymeric layer.