Invention Application
US20080152740A1 Flexible molding device for manufacturing a sunken groove or surface tie bar in a tire tread
有权
用于在轮胎胎面中制造凹槽或表面连接杆的柔性成型装置
- Patent Title: Flexible molding device for manufacturing a sunken groove or surface tie bar in a tire tread
- Patent Title (中): 用于在轮胎胎面中制造凹槽或表面连接杆的柔性成型装置
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Application No.: US11891970Application Date: 2007-08-14
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Publication No.: US20080152740A1Publication Date: 2008-06-26
- Inventor: Gia-Van Nguyen , Alain Emile Francois Roesgen , Peter Phelps Roch , Anne-France Gabrielle Jeanne-Marie Cambron , Yacine Ouyahia , Yvan Sac , Francis Bartholome , Gerard Louis Marie Schmit , Joel Andre Ghislain Delogne , Guy Jacobs , Raymond Marie Joseph Ghislain Houba , Bernard Marie Henin
- Applicant: Gia-Van Nguyen , Alain Emile Francois Roesgen , Peter Phelps Roch , Anne-France Gabrielle Jeanne-Marie Cambron , Yacine Ouyahia , Yvan Sac , Francis Bartholome , Gerard Louis Marie Schmit , Joel Andre Ghislain Delogne , Guy Jacobs , Raymond Marie Joseph Ghislain Houba , Bernard Marie Henin
- Main IPC: B28B7/06
- IPC: B28B7/06 ; B29D30/66

Abstract:
A tire mold and a molding device for forming a sunken groove in a tire are provided. The molding device includes one or more rigid elements joined to a flexible member. The flexible member is formed from a flexible material, preferably a superalloy, or hyperelastic material. The molding device may further comprise a magnet. A portion of the flexible member is positioned in contact with a first surface of a relief forming element of a mold and the rigid element has a mating surface in mating contact with a second surface of the relief forming element. The mold further may further comprise a second relief forming element positioned adjacent the first relief forming element, wherein the rigid element further includes an outer surface in mating contact with a surface of said second relief forming element.
Public/Granted literature
- US07544053B2 Flexible molding device for manufacturing a sunken groove or surface tie bar in a tire tread Public/Granted day:2009-06-09
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