Invention Application
US20080152744A1 Flexible molding device for manufacturing a sunken groove in a tire tread
有权
用于在轮胎胎面中制造凹槽的柔性模制装置
- Patent Title: Flexible molding device for manufacturing a sunken groove in a tire tread
- Patent Title (中): 用于在轮胎胎面中制造凹槽的柔性模制装置
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Application No.: US11891874Application Date: 2007-08-14
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Publication No.: US20080152744A1Publication Date: 2008-06-26
- Inventor: Gia-Van Nguyen , Yacine Ouyahia , Alain Emile Francois Roesgen , Yvan Sac , Francis Bartholome , Gerard Louis Marie Schmit , Anne-France Gabrielle Jeanne-Marie Cambron , Joel Andre Ghislain Delogne , Guy Jacobs , Andre Domange
- Applicant: Gia-Van Nguyen , Yacine Ouyahia , Alain Emile Francois Roesgen , Yvan Sac , Francis Bartholome , Gerard Louis Marie Schmit , Anne-France Gabrielle Jeanne-Marie Cambron , Joel Andre Ghislain Delogne , Guy Jacobs , Andre Domange
- Main IPC: B29D30/66
- IPC: B29D30/66
Abstract:
A mold and molding device for forming a sunken groove in a tire is provided. The molding device includes a thin flexible wire having a desired cross-sectional shape. The wire thickness can range from about 0.5 mm to about 5 mm. The flexible wire is preferably hyperelastic. An optional molding element may be connected to the flexible wire.
Public/Granted literature
- US07575424B2 Flexible molding device for manufacturing a sunken groove in a tire tread Public/Granted day:2009-08-18
Information query
