发明申请
- 专利标题: Integrated circuit device, and method of fabricating same
- 专利标题(中): 集成电路器件及其制造方法
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申请号: US12069704申请日: 2008-02-12
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公开(公告)号: US20080153213A1公开(公告)日: 2008-06-26
- 发明人: Pierre Fazan
- 申请人: Pierre Fazan
- 主分类号: H01L21/782
- IPC分类号: H01L21/782
摘要:
There are many inventions described and illustrated herein. In a first aspect, the present invention is directed to integrated circuit device including SOI logic transistors and SOI memory transistors, and method for fabricating such a device. In one embodiment, integrated circuit device includes memory portion having, for example, PD or FD SOI memory cells, and logic portion having, for example, high performance transistors, such as Fin-FET, multiple gate transistors, and/or non-high performance transistors (such as single gate transistors that do not possess the performance characteristics of the high performance transistors). In another aspect, the present invention is directed to a method of manufacture of such integrated circuit device.
公开/授权文献
- US07736959B2 Integrated circuit device, and method of fabricating same 公开/授权日:2010-06-15
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