发明申请
- 专利标题： Thermally Enhanced IC Package and Method
- 专利标题（中）： 热增强IC封装和方法
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申请号： US11672765申请日： 2007-02-08
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公开(公告)号： US20080157300A1公开(公告)日： 2008-07-03
- 发明人: Shih-Fang Chuang , Howard R. Test
- 申请人： Shih-Fang Chuang , Howard R. Test
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/56
摘要：
Methods for assembling thermally enhanced semiconductor device packages are disclosed in which a chip assembly has a chip affixed to a leadframe. A thermal pad is affixed to a surface of the chip, and the chip assembly is encapsulated whereby a surface of the thermal pad remains exposed to form at least a portion of a surface of the package favorable for the egress of heat from the chip. Also disclosed are thermally enhanced semiconductor device packages made using the methods of the invention.
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