发明申请
US20080157353A1 Control of Standoff Height Between Packages with a Solder-Embedded Tape
审中-公开
使用焊接嵌入式磁带控制封装间的间隔高度
- 专利标题： Control of Standoff Height Between Packages with a Solder-Embedded Tape
- 专利标题（中）： 使用焊接嵌入式磁带控制封装间的间隔高度
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申请号： US11618417申请日： 2006-12-29
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公开(公告)号： US20080157353A1公开(公告)日： 2008-07-03
- 发明人: Masako Watanabe , Masazumi Amagai
- 申请人： Masako Watanabe , Masazumi Amagai
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A microelectronic device package interconnect for electrically connecting a plurality of substrates is provided. The microelectronic device package interconnect comprises an insulative layer positioned on a substrate, wherein the insulative layer has an opening extending through the insulative layer to the substrate. The microelectronic device package interconnect further comprises solder positioned in the opening.
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