发明申请
- 专利标题： OPTICAL MODULATOR MODULE PACKAGE
- 专利标题（中）： 光学调制器模块封装
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申请号： US11957107申请日： 2007-12-14
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公开(公告)号： US20080158649A1公开(公告)日： 2008-07-03
- 发明人: Heung-Woo Park , Tae-Won Lee , Sang-Kyeong Yun , Chang-Su Park , Victor Yurlov , Jong-Hyeong Song
- 申请人： Heung-Woo Park , Tae-Won Lee , Sang-Kyeong Yun , Chang-Su Park , Victor Yurlov , Jong-Hyeong Song
- 申请人地址： KR Suwon
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2006-0135133 20061227
- 主分类号： G02B26/02
- IPC分类号： G02B26/02
摘要：
The present invention relates to a MEMS package, more specifically to an optical module package. According to an aspect of the present invention, the optical modulator module package includes an optical modulator, emitting a beam of light, which is modulated by diffracting and interfering the beam of light by an upwardly and downwardly spaced distance of a mirror, the beam of light being incident from a light source; a driver IC, mounted on the surrounding of the optical modulator to drive the optical modulator; and a noise removing member, intercepting a beam of light, which is not incident to a mirror area of the light modulator, of the incident beams of light.