发明申请
- 专利标题: Latent Curing Agent
- 专利标题(中): 潜在固化剂
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申请号: US11884527申请日: 2006-06-02
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公开(公告)号: US20080161589A1公开(公告)日: 2008-07-03
- 发明人: Katsuhiko Komuro , Tadasu Kawashima , Masahiko Ito , Daisuke Masuko
- 申请人: Katsuhiko Komuro , Tadasu Kawashima , Masahiko Ito , Daisuke Masuko
- 申请人地址: JP TOKYO
- 专利权人: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- 当前专利权人: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- 当前专利权人地址: JP TOKYO
- 优先权: JP2005-165093 20050606; JP2006-026912 20060203
- 国际申请: PCT/JP06/11054 WO 20060602
- 主分类号: C07F5/06
- IPC分类号: C07F5/06
摘要:
An aluminum chelate-based latent curing agent capable of curing a thermosetting epoxy resin under the condition of relatively low temperature in a short period of time is provided. Furthermore, a method for manufacturing the latent curing agent is provided, in which the curing conditions of the aluminum chelate-based latent curing agent can be controlled relatively easily.The aluminum chelate-based latent curing agent is prepared by reacting an aluminum chelate agent with a silsesquioxane type oxetane derivative in the presence of a water insoluble or poorly water-soluble cellulose ether, whereby latency properties are imparted thereto. This latent curing agent contains a coating layer composed of the water insoluble or poorly water-soluble cellulose ether. Preferably, the surface is treated with an isocyanate compound.
公开/授权文献
- US07557230B2 Latent curing agent 公开/授权日:2009-07-07
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