发明申请
- 专利标题： Electric power converter and mounting structure of semiconductor device
- 专利标题（中）： 电力转换器和半导体器件的安装结构
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申请号： US12073871申请日： 2008-03-11
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公开(公告)号： US20080164607A1公开(公告)日： 2008-07-10
- 发明人: Daisuke Harada , Hiroshi Ishiyama
- 申请人： Daisuke Harada , Hiroshi Ishiyama
- 申请人地址： JP Kariya-city
- 专利权人： Denso Corporation
- 当前专利权人： Denso Corporation
- 当前专利权人地址： JP Kariya-city
- 优先权： JP2003-297833 20030821; JP2003-299248 20030822
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.