发明申请
- 专利标题: Substrate holding apparatus and polishing apparatus
- 专利标题(中): 基板保持装置和抛光装置
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申请号: US12073430申请日: 2008-03-05
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公开(公告)号: US20080166957A1公开(公告)日: 2008-07-10
- 发明人: Tetsuji Togawa , Hiroshi Yoshida , Osamu Nabeya , Makoto Fukushima , Koichi Fukaya
- 申请人: Tetsuji Togawa , Hiroshi Yoshida , Osamu Nabeya , Makoto Fukushima , Koichi Fukaya
- 优先权: JP2003-033015 20030210; JP2003-163051 20030606; JP2003-163052 20030606
- 主分类号: B24B7/22
- IPC分类号: B24B7/22
摘要:
A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.
公开/授权文献
- US07988537B2 Substrate holding apparatus and polishing apparatus 公开/授权日:2011-08-02