发明申请
- 专利标题： ENHANCED WAFER CLEANING METHOD
- 专利标题（中）： 增强清洗方法
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申请号： US11954167申请日： 2007-12-11
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公开(公告)号： US20080169008A1公开(公告)日： 2008-07-17
- 发明人: Seokmin Yun , John M. Boyd , Mark Wilcoxson , John de Larios
- 申请人： Seokmin Yun , John M. Boyd , Mark Wilcoxson , John de Larios
- 主分类号： B08B13/00
- IPC分类号： B08B13/00
摘要：
A method for removing post-processing residues in a single wafer cleaning system is provided. The method initiates with providing a first heated fluid to a proximity head disposed over a substrate. Then, a meniscus of the first fluid is generated between a surface of the substrate and an opposing surface of the proximity head. The substrate is linearly moved under the proximity head. A single wafer cleaning system is also provided.
公开/授权文献
- US07568488B2 Enhanced wafer cleaning method 公开/授权日：2009-08-04
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