发明申请
US20080171440A1 Pre-polishing treatment solution for interconnect substrate, polishing method, and method and apparatus for manufacturing interconnect substrate
审中-公开
用于互连基板的预抛光处理溶液，抛光方法以及用于制造互连基板的方法和装置
- 专利标题： Pre-polishing treatment solution for interconnect substrate, polishing method, and method and apparatus for manufacturing interconnect substrate
- 专利标题（中）： 用于互连基板的预抛光处理溶液，抛光方法以及用于制造互连基板的方法和装置
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申请号： US12007786申请日： 2008-01-15
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公开(公告)号： US20080171440A1公开(公告)日： 2008-07-17
- 发明人: Akira Kodera , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Itsuki Kobata
- 申请人： Akira Kodera , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Itsuki Kobata
- 优先权： JP2007-006489 20070116
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; C23F11/14 ; B23H3/00
摘要：
A pre-polishing treatment solution has a prominent corrosion inhibiting effect, and can be used in pre-polishing treatments for interconnect substrates. The pre-polishing treatment solution comprises a corrosion inhibitor dissolved in an organic solvent.
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