发明申请
- 专利标题: INJECTION MOLDING APPARATUS
- 专利标题(中): 注射成型设备
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申请号: US11874302申请日: 2007-10-18
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公开(公告)号: US20080175946A1公开(公告)日: 2008-07-24
- 发明人: Han Sub HWANG , Sung Ki Min , Sang Hun Lee , Jong Won Lee
- 申请人: Han Sub HWANG , Sung Ki Min , Sang Hun Lee , Jong Won Lee
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2007-0006606 20070122
- 主分类号: B29C45/72
- IPC分类号: B29C45/72
摘要:
An injection molding apparatus capable of minimizing cracks at the corners of a mold is provided. The injection molding apparatus includes first and second molds that mate with each other to define a molding cavity, a stationary member that supports the first mold, a movable member that supports the second mold and moves backwards and forwards together with the second mold, and a plurality of pressing members installed around the first mold so as to press a periphery of the first mold toward the molding cavity by a pressing force of the movable member when the first mold is mated with the second mold.
公开/授权文献
- US07670134B2 Injection molding apparatus 公开/授权日:2010-03-02
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