A method for the improved electroplating of copper onto a copper seed layer provides treating the surface of a copper seed layer with nitrogen or another anaerobic gas. In another aspect, a burnishing treatment is used to enhance the platability of the copper seed layer. According to another aspect, the seed layer is annealed either at an elevated temperature or for an extended time at room temperature. According to another aspect, the seed layer surface is exposed to a chemical solution that includes a surfactant, chemicals that dissolve contaminants, or both. In another aspect, the deposition of the copper seed layer may be tailored to produce a surface morphology more suited to electroplating. Following the treatment of the seed layer, the copper layer that is electroplated onto the seed layer exhibits improved quality.